Custom TGV Glass Substrates | Through-Glass Via Solutions Provider

What is TGV (Through Glass Via) Glass Substrate?

TGV glass substrates are advanced interconnection materials that involve forming vertical through-holes (vias) directly in a glass wafer or panel. These substrates are crucial components in cutting-edge electronic and microelectronic packaging applications, especially in 3D integration, MEMS devices, RF modules, optoelectronic interconnects, microfluidics, and biosensors.

Key advantages of TGV substrates include:

• Outstanding electrical insulation و الثبات الحراري, ensuring reliable performance under demanding conditions.
• Low dielectric constantمثالية لـ high-frequency signal transmission, reducing signal loss and cross-talk.
• Excellent compatibility with heterogeneous integration و miniaturization, allowing seamless integration of multiple functions in ultra-compact designs.

في Lighting, we provide end-to-end TGV glass substrate customization and processing services tailored to the most demanding requirements of modern semiconductor and photonics applications.

Our TGV-Compatible Glass Materials

We supply and process a broad range of high-performance optical glass materials commonly used for TGV applications. Our selection includes both internationally renowned brands و domestic specialty glass, ensuring optimal material choice for your specific application.

These glass types are meticulously selected for their dimensional stability, optical performanceو machinability, making them the ideal base materials for TGV structures across multiple domains.

Our Capabilities in TGV Glass Substrate Processing

As a leading precision optical glass enterprise, Guangzhou Lighting Glass Co., Ltd. delivers state-of-the-art TGV machining services, leveraging a robust combination of equipment, expertise, and process control. We support a variety of via types and geometries to match the complexity of modern electronic packaging systems.

TGV Microhole Processing Techniques

• Laser Drilling – High-speed, high-accuracy non-contact drilling with minimal thermal impact
• CNC Mechanical Drilling – Ideal for larger via structures with tight tolerance control

Via Specifications and Customization Options

• Through-Hole Diameter Range: 30μm to 1mm
• Tolerance Control: Within ±5μm, ensuring precise via dimensions for advanced packaging
• Hole Types Supported: Through-Hole, Blind-Hole, Stepped Vias, based on design requirements
• Custom Via Array Design: We support bespoke hole arrays with controlled density, pitch, and layout patterns
• Surface Preparation: Smoothness and cleanliness guaranteed, suitable for post-drilling metallization or filling

Our in-house capability to control critical parameters like via size, wall quality, and depth uniformity enables us to meet strict industry standards for MEMS, RF, and optical device integration.

Typical Application Fields of Our TGV Glass Substrates

Thanks to the superior dielectric properties and excellent optical transparency of our glass materials, our TGV substrates are utilized across a broad range of high-tech industries:

3D Packaging & TSV Interconnection

TGV glass acts as an interposer or redistribution layer, facilitating vertical electrical connections و stacking of chips or dies, vital for system miniaturization in mobile and computing platforms.

Millimeter-Wave RF Device & Filter Packaging

The low dielectric constant and high thermal stability of our glass make it perfect for RF signal transmission, especially in 5G, radar, and satellite communication systems.

Optoelectronic Chip Packaging & Optical Modules

Our transparent glass substrates are ideal for optical alignment, laser diode packagingو high-speed optical interconnects, enabling higher bandwidth in photonic integration.

Microfluidics & Biosensing Platforms

TGV substrates provide microchannel interfaces و sample-injection points in lab-on-chip systems, supporting bioassays, DNA analysisو point-of-care diagnostics.

MEMS Component Support Structures

Our ultra-flat, stable glass substrates support cavity structures, cap layersو micromechanical component integration, essential for inertial sensors, pressure sensorsو microspeakers.

Why Choose Guangzhou Lighting Glass Co., Ltd. for TGV Glass Substrates?

مع أكثر من 15 years of specialization in glass processing, we have developed deep technical know-how and optimized workflows that ensure consistency, quality, and scalability.

🔬 الخبرة في المجال

Our engineering team has extensive experience in optical glass machining و microfabrication, enabling us to solve complex challenges in precision via creation و substrate design.

🏭 Advanced Equipment Infrastructure

We operate an in-house fleet of top-tier machines, including:

• Large-format CNC engraving systems
• High-precision laser drilling stations
• Waterjet and ultrasonic cutting units
• Ultrasonic cleaning systems
• Surface polishing and finishing tools

These resources allow us to handle orders of any scale, from sample prototyping إلى mass production.

Cleanroom-Grade Processing

All TGV substrates are processed in controlled environments, minimizing particulate contamination and maintaining substrate integrity for downstream metallization or wafer bonding processes.

Flexible Volume Support & Fast Lead Times

We cater to R&D samples, pilot productionو high-volume batch manufacturing, ensuring short delivery cycles و global shipping capabilities to meet your project’s needs.

Partner with Us for High-Performance TGV Glass Substrates

As the authorized distributor of Corning Eagle XG®, Corning Pyrex® SG3.3, and SCHOTT BOROFLOAT® 33, Guangzhou Lighting Glass Co., Ltd. offers unmatched access to premium glass materials, backed by a robust processing infrastructure. Our commitment to الدقة, innovationو customer-centric service makes us the trusted partner for leading semiconductor, photonics, and biotech companies.

Contact us today to discuss your TGV glass substrate requirements. Whether your project is in early prototyping or full-scale production, we provide tailored glass solutions that meet the highest performance standards in the industry.