custom glass cover plate for semiconductors

As a global custom glass manufacturer, we specialize in providing high-precision glass materials and bespoke processing services tailored for the most demanding industries — including organic semiconductors, MEMS, AR/VR optics, medical diagnostics, and academic research. Our products have been trusted by leading laboratories and institutions worldwide.

custom glass cover plate for semiconductors
glass cover with edge step for encapsulation
custom glass cover plate

We proudly deliver solutions for researchers seeking advanced glass cover plates with center cutouts, edge steps, and optical-level surface finishes, meeting exact design and application-specific criteria.

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    Custom glass cover plate with Central Openings and Edge Steps

    glass cover with edge step for encapsulation

    One of the product lines we most frequently request includes custom glass covers for various advanced applications. These include encapsulation covers with precisely cut center cavities and stepped edges for bonding and sealing, as well as protective glass Windows, transparent covers for microfluidic devices, and substrates for bonding or optical alignment. Whether used to protect organic semiconductor devices, support MEMS structures, or seal thin-film sensors, our components can operate reliably in harsh environments.

    Our capabilities include:

    • CNC milling of circular or rectangular openings with tight tolerance control
    • Edge step machining for adhesive bonding or pressure sealing
    • Ultra-smooth surfaces polished down to Ra < 5 Å for optical transparency
    • Dimensional consistency within ±0.01 mm, even for small batches

    These features make our glass substrates ideal for research packaging applications where both mechanical fit and surface quality directly affect device integrity and test validity.

    organic semiconductor packaging

    Tailored Glass Solutions for Research-Driven Applications

    We work extensively with scientific labs, university departments, and R&D teams on projects involving organic semiconductor packaging, OLED displays, and next-generation sensors. Our products have been applied in:

    • Organic photovoltaic encapsulation
    • Flexible transistor packaging
    • Wafer-level MEMS protection
    • Glass covers for photonic experiments
    • Microfluidic chip sealing

    Our engineers are fluent in research language and experimental needs. Whether your design is in CAD, a hand-drawn sketch, or simply a functional requirement, we will help translate it into a manufacturable glass part — fast and reliably.

    Precision CNC Glass Machining for Scientific Use

    Our advanced CNC machining capabilities allow us to deliver custom geometries for even the most complex device housing structures. We can achieve:

    ParameterCapability
    Minimum Thickness0.10 mm
    Maximum Size600 mm × 600 mm
    Central Cutout Tolerance±0.02 mm
    Step Depth / Edge Feature±0.01 mm accuracy
    Surface Roughness (Ra)Down to 5 Å (0.5 nm)
    Materials AvailableBOROFLOAT® 33, D263T™, AF32®, Gorilla Glass®, Quartz, etc.
    Cleanroom CompatibilityClass 1000 (ISO 5) ultrasonic cleaning and vacuum packaging

    These capabilities make us a preferred partner for optical wafer polishing, glass cover micro-machining, and encapsulation glass manufacturing for scientific and experimental applications.

    Why Researchers Worldwide Trust Us

    Our company is not just a glass factory — we are a solution partner to researchers. We understand:

    Professional

    The need for rapid response and technical consultation

    Understand glass materials

    The importance of material selection for optical clarity, chemical resistance, and temperature stability

    low MOQ

    The typical constraints of low-volume, high-spec academic orders

    Extremely small tolerance

    The demands of working with complex sealing geometries, including flatness and parallelism glass tolerances

    We have successfully delivered custom cover plate solutions to institutions in Germany, France, the U.S., Korea, and beyond. Our client list includes government-funded labs, semiconductor research hubs, and interdisciplinary engineering teams.

    Custom Glass for Organic Semiconductor Packaging

    The packaging of organic semiconductor devices requires precise, inert and stable materials that do not interfere with optical or electrical properties. We can offer you:

    • Inert encapsulation without outgassing
    • Highly customizable edge profiles for gluing, pressure fitting, or thermal bonding
    • Cutout windows to prevent interference with active layers
    • Coating compatibility for AR or hydrophobic finishes if required

    These attributes make our glass plates ideal for research into organic field-effect transistors (OFETs), organic light-emitting diodes (OLEDs), thin-film encapsulation, and more.

    Start with a Drawing, End with a Solution

    Whether you’re preparing your first experimental run or optimizing a critical long-term test, we help research groups move quickly from idea to hardware. Our technical sales engineers work closely with your team to:

    • Review drawings or sketches
    • Offer suggestions on material, tolerance, and finish
    • Provide quick quotations (within 24–48 hours)
    • Ensure repeatable results for scale-up and publication

    There is no minimum order quantity, and we accommodate multiple design iterations without delay.

    Glass Surface Finishing and Polishing Services

    In addition to geometric processing, we offer precision glass lapping and polishing services to meet ultra-flat, bonding-grade specifications. For applications requiring optical wafer polishing, cleanroom-grade surface prep, or flatness and parallelism glass matching across multi-layer stacks, we offer:

    • Double-sided polishing for uniformity
    • Thickness tolerance to ±0.005 mm
    • Flatness up to λ/10 for laser alignment or bonding
    • Edge chamfering and protective packaging

    Our glass surface finishing processes enhance sealing reliability, reduce particle contamination, and provide the precision needed in device-level research.

    Glass Substrates Engineered for Innovation

    Whether you are developing a chip-scale OLED, a sealed microfluidic sensor, or a multi-layer hybrid stack, we can build the glass interface you need — accurately, quickly, and with full transparency in both communication and material.

    Request a Quote Today

    If you’re looking for a custom glass cover plate with a center cutout and adhesive step, or any kind of research-grade encapsulation glass, contact us today. You can upload your drawing, sketch, or reference photo — and we will reply with a detailed quote and timeline.

    We serve clients worldwide with fast shipping, technical responsiveness, and the precision only a specialist can offer.

    Let’s bring your experiment to life — with glass that fits.

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