Excellent thermal stability:PYREX SG3.3 has a thermal expansion coefficient of 3.3 × 10⁻⁶/℃, which makes it excellent in high and low temperature environments and can effectively resist thermal shock.
Excellent chemical tolerance:The glass has good resistance to a variety of chemicals and can resist the attack of acids, bases and organic solvents, making it suitable for use in laboratory and industrial applications.
High light transmittance:PYREX SG3.3 has a light transmittance of over 90% in the 400-800 nm range, ensuring clear visual effects in optical applications.
Compatibility with silicon materials:The thermal expansion coefficient of the glass matches that of silicon material, making it ideal for cover glass in the semiconductor industry, enabling stress-free, bubble-free welding.
Consistent surface quality:PYREX SG3.3 provides a consistent, direct-bonding surface that eliminates the need to distinguish between front and back, simplifying the manufacturing process and increasing productivity.
CORNING PYREX SG3.3 is a borosilicate glass with a thermal expansion coefficient that matches that of silicon, effectively combines with silicon during anodic bonding, and has a thermal expansion rate that can withstand high temperatures and harsh environments. More importantly, since the CORNING PYREX SG3.3 contains an alkaline component, an efficient anodic bonding process can be achieved. When the temperature continues to rise up to 450 ℃,CORNING PYREX SG3.3 can still provide a consistent, bondable surface, do not need to distinguish between one side and the other side, through the use of industry standard bonding equipment, can be carried out without voids, low stress bonding, and ultimately produce strong and durable bonds, without the need for adhesives or excessive temperatures.
This product is specially designed for anodic bonding applications in the semiconductor and electronics industries and can withstand high temperatures and harsh environments. CORNING® PYREX® SG3.3 provides a consistent, bondable surface that eliminates the need to distinguish between front and back sides for void-free, low-stress bonding using industry-standard bonding equipment.
As a leading Corning Pyrex SG3.3 Borosilicate Glass manufacturer in China, we specialize in precision processing and custom fabrication of Corning Pyrex SG3.3 substrates for diverse industrial applications. Our state-of-the-art facilities and experienced engineering team deliver tailored custom optical glass solutions with guaranteed quality and competitive pricing for global customers.
We proudly support universities, laboratories, and research institutes worldwide, providing not only high-performance Corning Pyrex SG3.3 Borosilicate Glass but also technical guidance and collaborative customization to accelerate innovation in scientific research, pharmaceutical manufacturing, and industrial processing.
Get a Quote for Corning Pyrex SG3.3 Processing
Property | Specification | Typical Applications |
---|---|---|
Thickness Range | 0.5 mm – 50 mm | Laboratory equipment, optical components |
Size Capability | Up to 1200 mm × 800 mm | Large format windows, industrial equipment |
Surface Quality | <1 nm Ra (optical polish) | Precision optics, laser applications |
Flatness | <2 μm over 100 mm | Semiconductor wafers, optical substrates |
Edge Quality | Ground, polished, or fire-polished | Custom requirements |
Thermal Expansion | 3.3 × 10⁻⁶/K | High-temperature applications |
Custom dimensions available per customer drawings and specifications. Prototype to high-volume production capabilities.
As an authorized Corning China Agent (China distributor), we provide:
Advanced Manufacturing Capabilities Our precision processing equipment and temperature-controlled facilities ensure consistent quality for Corning Pyrex SG3.3 Borosilicate Glass wafer and substrate applications.
Technical Expertise Experienced glass engineers provide design optimization and process consulting for your specific thermal and chemical requirements.
Quality Assurance Comprehensive inspection and testing protocols guarantee dimensional accuracy, thermal performance, and chemical resistance.
Global Supply Chain Efficient logistics and export capabilities serve customers worldwide with competitive lead times.
Competitive Pricing Advantage We offer factory-direct pricing, allowing us to deliver cost-effective solutions without compromising on quality — ideal for both research-scale prototyping and industrial mass production.
Q: What makes Corning Pyrex SG3.3 Borosilicate Glass different from regular glass?
A: Corning Pyrex SG3.3 Borosilicate Glass features low thermal expansion (3.3 × 10⁻⁶/K), superior chemical resistance, and high-temperature stability up to 500°C, making it ideal for demanding scientific and industrial applications where regular glass would fail.
Q: Can you process Corning Pyrex SG3.3 Borosilicate Glass wafers for semiconductor applications?
A: Yes, we offer complete Corning Pyrex SG3.3 Borosilicate Glass wafer processing including precision cutting, surface polishing, anodic bonding preparation, and specialized cleaning for semiconductor and MEMS applications.
Q: What is the minimum order quantity for custom Corning Pyrex SG3.3 processing?
A: We support both prototyping (as low as 1 piece) and high-volume production. MOQ depends on specific processing requirements and can be discussed based on your project needs.
Q: What quality certifications do you maintain for Corning Pyrex SG3.3 processing?
A: We maintain ISO 9001:2015 certification and follow strict quality control protocols including dimensional inspection, thermal stress analysis, chemical resistance testing, and surface quality verification for all processed substrates.
Q: Do you provide technical support for application-specific requirements?
A: Yes, our technical team provides comprehensive support including material selection guidance, thermal analysis, chemical compatibility assessment, and custom design consultation for your specific application needs.
Q: Can Corning Pyrex SG3.3 Borosilicate Glass be used for microfluidic applications?
A: Definitely. Corning Pyrex SG3.3 Borosilicate Glass is excellent for microfluidic devices due to its chemical inertness, optical clarity, and compatibility with anodic bonding processes commonly used in microfluidic chip fabrication.
Q: Is there a channel to purchase Corning Pyrex SG3.3?
Corning has authorized Guangzhou Lighting Glass Co., Ltd. as the designated distributor in China. You can obtain genuine materials through them or directly cooperate with us.
Contact us today for your Corning Pyrex SG3.3 Borosilicate Glass processing needs – from prototype to production, we deliver precision and quality you can trust.
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